of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conductive fabricare imprimate circuite lines called tracks or circuit paths, pads for connections, metallized holes (vias) for passing connections between layers of copper as solid conductive areas for electromagnetic shielding or other purposes. Each of the
and reduces the chances of solder shorting between traces or unwanted electrical contact with possible loose wires. For its function of helping to prevent solder shorts, the coating is called imprimate fabricare circuite a solder mask. Soldermask is generally green in color but can have different colors: green, red, blue, white, black. Only the outer
more than two, four and especially more than six layers of copper has been concurrent with the adoption of surface mount technology. "Through holes" components are assembled by their legs passing through the board and glued to the pads on the other side. "SMD" imprimate circuite fabricare components are soldered