The stencil for the printed circuit boards is manufactured by laser cutting from a stainless steel material.
The printed circuit stencil manufactured by us can be with frame or without frame depending on the machine with which the solder paste is applied to the printed circuit.
Stencil dimensions with frame:
Minimum 400 x 300 mm; maximum 1400 x 500 mm
Stencil dimensions without frame:
Minimum 380 x 280mm; maximum 460 x 460 mm
Stencil thickness: 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.
For the production of the stencil necessary for assembly your printed circuit board, we can offer you customized solutions according to the specifications in your documentation.
on the same side of the board. A board can use both methods for soldering components. Today PCBs with components mounted only through holes are now less common. Surface mount is used for components like transistors, diodes, Stencil IC chips, resistors and capacitors. Through-hole mounting can be used
boards is the double layer board. It has copper on both sides, which are called outer layers; Multilayer sandwich boards with additional internal layers of copper and insulation are called multilayer. PCBs can be single-sided (one layer of copper), double-sided Stencil (two layers of copper on both
thickness and length, must Stencil be small enough for the current the conductor will carry. It is recommended that the power and force paths be larger than the signal paths. In a multi-layer board, an internal layer may be mostly solid copper to act as a ground plane for shielding and
