The stencil for the printed circuit boards is manufactured by laser cutting from a stainless steel material.
The printed circuit stencil manufactured by us can be with frame or without frame depending on the machine with which the solder paste is applied to the printed circuit.
Stencil dimensions with frame:
Minimum 400 x 300 mm; maximum 1400 x 500 mm
Stencil dimensions without frame:
Minimum 380 x 280mm; maximum 460 x 460 mm
Stencil thickness: 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.
For the production of the stencil necessary for assembly your printed circuit board, we can offer you customized solutions according to the specifications in your documentation.
etc.; each layer of Stencil copper is etched and any internal sleepers (which will not extend to both outer surfaces of the finished multilayer board) are plated before the layers are laminated together. FR-4 epoxy glass is the most common insulating substrate. Flexible-Rigid printed circuits are boards
was one of the first Stencil aids that allowed this modernization. The smaller and smaller dimensions and the flexibility of the printed circuit board made in recent years have greatly helped fields such as medicine and aeronautics to benefit from smaller and lighter equipment that has allowed them a high degree of development and
through the board and glued to the pads on the other side. "SMD" components are soldered on the same side of Stencil the board. A board can use both methods for soldering components. Today PCBs with components mounted only through holes are now less common. Surface mount is used for components like transistors,
