The stencil for the printed circuit boards is manufactured by laser cutting from a stainless steel material.
The printed circuit stencil manufactured by us can be with frame or without frame depending on the machine with which the solder paste is applied to the printed circuit.
Stencil dimensions with frame:
Minimum 400 x 300 mm; maximum 1400 x 500 mm
Stencil dimensions without frame:
Minimum 380 x 280mm; maximum 460 x 460 mm
Stencil thickness: 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.
For the production of the stencil necessary for assembly your printed circuit board, we can offer you customized solutions according to the specifications in your documentation.
will carry. It is recommended that the power and force paths be larger than the signal paths. In a multi-layer board, an internal layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave printed circuits, transmission Stencil lines can be laid out in
in almost all electronic products and some electrical products. Currently, the production and assembly of printed circuits are automated. Electronic computer aided design software is available Stencil to do much of the layout work. Multilayer PCBs allow for much higher component density because the component paths on the inner layers
copper as solid conductive areas for electromagnetic shielding or other purposes. Each of the conductive layers is designed with copper tracks (similar to wires on a flat surface) that provide electrical connections on that conductive layer. Another Stencil manufacturing process adds plated or metallized holes that allow interconnections between layers.
