The stencil for the printed circuit boards is manufactured by laser cutting from a stainless steel material.
The printed circuit stencil manufactured by us can be with frame or without frame depending on the machine with which the solder paste is applied to the printed circuit.
Stencil dimensions with frame:
Minimum 400 x 300 mm; maximum 1400 x 500 mm
Stencil dimensions without frame:
Minimum 380 x 280mm; maximum 460 x 460 mm
Stencil thickness: 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.
For the production of the stencil necessary for assembly your printed circuit board, we can offer you customized solutions according to the specifications in your documentation.
assembly of printed circuits are automated. Electronic computer aided design software is available to do much of the layout work. Stencil Multilayer PCBs allow for much higher component density because the component paths on the inner layers would occupy the space between the components. The increase in the need for multilayer printed circuit boards
carefully controlled to ensure consistent impedance. In RF Stencil and fast switching circuits, the inductance and capacitance of the printed circuit board conductors become significant, usually unwanted, circuit elements; rather, they can be used as part of the circuit design, as in distributed element filters, antennas, and fuses, avoiding the
printed circuit with a specific stack-up, it must be taken into account that the internal tracks with controlled impedance are shielded by copper planes and for this reason only the thickness of the insulation between layers and tracks and the track thickness must be taken into account. Stencil
