The stencil for the printed circuit boards is manufactured by laser cutting from a stainless steel material.
The printed circuit stencil manufactured by us can be with frame or without frame depending on the machine with which the solder paste is applied to the printed circuit.
Stencil dimensions with frame:
Minimum 400 x 300 mm; maximum 1400 x 500 mm
Stencil dimensions without frame:
Minimum 380 x 280mm; maximum 460 x 460 mm
Stencil thickness: 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.
For the production of the stencil necessary for assembly your printed circuit board, we can offer you customized solutions according to the specifications in your documentation.
technology a flexible printed circuit made of a thin polyamide of 0.1-0.3 mm with a rigid printed circuit on an FR4 substrate. These printed circuits are used Stencil more and more lately, having the advantage of their flexibility. A PCB may have an inscription or screen printing that identifies components, test points or identification
the power and force paths be larger than the signal paths. In a multi-layer board, an internal layer may be mostly solid copper to act Stencil as a ground plane for shielding and power return. For microwave printed circuits, transmission lines can be laid out in a planar form, such as stripline or microstrip, with
for connections, metallized holes (vias) for passing connections between layers of copper as solid conductive areas for electromagnetic shielding or other purposes. Each of the conductive layers is designed with copper tracks (similar to wires on a flat surface) that provide electrical connections on that conductive layer. Another manufacturing process adds Stencil plated or metallized holes
