The stencil for the printed circuit boards is manufactured by laser cutting from a stainless steel material.
The printed circuit stencil manufactured by us can be with frame or without frame depending on the machine with which the solder paste is applied to the printed circuit.
Stencil dimensions with frame:
Minimum 400 x 300 mm; maximum 1400 x 500 mm
Stencil dimensions without frame:
Minimum 380 x 280mm; maximum 460 x 460 mm
Stencil thickness: 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.
For the production of the stencil necessary for assembly your printed circuit board, we can offer you customized solutions according to the specifications in your documentation.
width, thickness and length, must be small enough for the current the conductor will carry. It is recommended that the power and force paths be larger than the signal paths. In a Stencil multi-layer board, an internal layer may be mostly solid copper to act as a ground
covered with solder mask, the inner copper layers are protected by the adjacent substrate layers. The soldering mask soldermask is made of a fluid substance like an ink and is applied in a thin layer similar to varnish on the Stencil entire surface of the printed circuit less on the soldering pads and it also
the printed circuit, called serigraphy or silkscreen for short, is done on the top layer of the PCB and has the role of a reference indicator for the components on the PCB. Graphics and text on a circuit board's PCB are usually printed with a Stencil non-conductive permanent
