Multilayer PCB

Multilayer PCB

Multilayer PCB is a printed circuit board with several layers of copper made in a standard or specific stacking, with or without a solder mask and silkscreen.

Apart from the classic printed circuit boards with metallized holes from layer 1 to the final layer, we also make multilayer pcb with blind via, buried via or filled via.

The steps that a multi-layer boards through in manufacturing are:

  • Laminate cutout
  • Realization of internal layer
  • Lamination – Stack-up / pressing
  • Drilling
  • Metallization
  • Image transfer
  • Etching
  • Optical Testing (AOI)
  • Solder mask
  • Silkscreen
  • Finishing
  • Electrical test
  • Mechanical processing
  • Control-testing
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Properties of the printed circuit board

by its width, thickness and length, must be small enough for the current the conductor will carry. It is recommended that the power and PCB Multilayer force paths be larger than the signal paths. In a multi-layer board, an internal layer may be mostly solid copper to act as a ground

Controlled impedances of printed circuits

the higher the frequency, the better adaptation is required. When producing the printed circuit with controlled impedance, the impedance will be controlled by acting on the dimensions of the tracks and the distance between them, Multilayer PCB i.e. the insulation. For a multilayer printed circuit with a specific

Types of printed circuit board

mm with PCB Multilayer a rigid printed circuit on an FR4 substrate. These printed circuits are used more and more lately, having the advantage of their flexibility. A PCB may have an inscription or screen printing that identifies components, test points or identification text. Screen printing does not normally affect the operation

Contact:
SADELEC PCB
Address:
Moldova Street no. 15,
Pașcani, Postal code 705200
 

Phone:
0722480131
0726349074
 

E-mail:
contact@sadelec-pcb.com
cad@sadelec-pcb.com