Capabilitati tehnice
| Feature | value |
| Max layer count | max 40 |
| Material | FR4, Aluminiu, CEM3, Poliamida, Rogers |
| Max. Finishing Board Size | 600 x 890 mm |
| Min. and Max. Board Thickness | min 0,2 mm; max 7 mm |
| Max. copper (inner/outer) | max 210 um |
| Min. line width | 0,12 mm |
| Min. line space | 0,12 mm |
| Min space between trace to pads, pads to pads | 0,12 mm |
| Min. Drilling Size(Mechanical) | 0,15 mm |
| Laser drill (VIA) | 0,1 mm |
| Buried / Blind Via | Min diam 0,2mm |
| Plugged holes | with soldermask, copper or resin |
| Surface treatment | HAL fara Pb, OSP, ENIG (Immersion gold), Immersion Tin, Immersion Silver |
| Soldermask | Green, blue, red, black, white |
| Silkscreen | black, white, yellow |
| Carbon deposition for the keys | Yes |
| Peelable mask | Yes |
| UL 94V-0 | Yes |
| impedance control tolerance | +/- 10% |
| Flex board | Flex board with stiffener + rigid board |
| Special treatments | Gold contacts (gold fingers-hard gold), OSP |
| HASL | SMD 40µ to 2000µ", GND 30µ to 800µ" |
| ENIG | Au 1µ to 5µ", Ni 80µ to 200µ" |
| Immersion tin | 0.8µm to 1.2µm |
| Immersion silver | 0.15µm to 0.45µm |
| Hard gold plating | Au 1µ to 50µ", Ni 80µ to 200µ" |
| Peelable mask | 5mil |
| Carbon ink | 0.3mil |
| Half-cut/Castellated Hole | Yes max 0.6 mm |
as a ground plane or power plane, to achieve better signal integrity, higher signaling frequencies, and better power supply decoupling. In multilayer boards, layers of material are laminated together in an alternating Capability Manufacturing PCB sandwich: copper, substrate, copper, substrate, copper, etc.; each layer of copper is etched and any internal sleepers (which
and the printed circuit through its continuous improvement was one of the first aids that Manufacturing PCB Capability allowed this modernization. The smaller and smaller dimensions and the flexibility of the printed circuit board made in recent years have greatly helped fields such as medicine and aeronautics to benefit from smaller
a coating that protects the copper from corrosion and reduces the chances of solder shorting between traces or unwanted electrical contact with possible loose wires. For its function of helping to prevent solder shorts, the coating is called a solder mask. Soldermask is Capability PCB Manufacturing generally green in color
