Capabilitati tehnice
| Feature | value |
| Max layer count | max 40 |
| Material | FR4, Aluminiu, CEM3, Poliamida, Rogers |
| Max. Finishing Board Size | 600 x 890 mm |
| Min. and Max. Board Thickness | min 0,2 mm; max 7 mm |
| Max. copper (inner/outer) | max 210 um |
| Min. line width | 0,12 mm |
| Min. line space | 0,12 mm |
| Min space between trace to pads, pads to pads | 0,12 mm |
| Min. Drilling Size(Mechanical) | 0,15 mm |
| Laser drill (VIA) | 0,1 mm |
| Buried / Blind Via | Min diam 0,2mm |
| Plugged holes | with soldermask, copper or resin |
| Surface treatment | HAL fara Pb, OSP, ENIG (Immersion gold), Immersion Tin, Immersion Silver |
| Soldermask | Green, blue, red, black, white |
| Silkscreen | black, white, yellow |
| Carbon deposition for the keys | Yes |
| Peelable mask | Yes |
| UL 94V-0 | Yes |
| impedance control tolerance | +/- 10% |
| Flex board | Flex board with stiffener + rigid board |
| Special treatments | Gold contacts (gold fingers-hard gold), OSP |
| HASL | SMD 40µ to 2000µ", GND 30µ to 800µ" |
| ENIG | Au 1µ to 5µ", Ni 80µ to 200µ" |
| Immersion tin | 0.8µm to 1.2µm |
| Immersion silver | 0.15µm to 0.45µm |
| Hard gold plating | Au 1µ to 50µ", Ni 80µ to 200µ" |
| Peelable mask | 5mil |
| Carbon ink | 0.3mil |
| Half-cut/Castellated Hole | Yes max 0.6 mm |
can be laid out in a planar form, such as stripline or microstrip, with dimensions carefully controlled to ensure consistent impedance. In RF and fast switching PCB Manufacturing Capability circuits, the inductance and capacitance of the printed circuit board conductors become significant, usually unwanted, circuit elements; rather, they can be used as part of
printing is used to render useful information on the PCB board that can help users during assembly. It is used to mark component values, part numbers, test points, Capability Manufacturing PCB polarity, etc. Screen printing does not influence the printed circuit and the possible problems that may appear may be slight discolorations due to
be taken in designing the tracks to match the impedance of the upstream and downstream components. The longer the route or the higher the frequency, the better adaptation is required. When producing the printed circuit with controlled impedance, the Capability PCB Manufacturing impedance will be controlled by acting on the dimensions of the tracks and the distance between
