PCB Manufacturing Capability

PCB Manufacturing Capability

Capabilitati tehnice

Feature value
Max layer count max 40
Material FR4, Aluminiu, CEM3, Poliamida, Rogers
Max. Finishing Board Size 600 x 890 mm
Min. and Max. Board Thickness min 0,2 mm; max 7 mm
Max. copper (inner/outer) max 210 um
Min. line width 0,12 mm
Min. line space 0,12 mm
Min space between trace to pads, pads to pads 0,12 mm
Min. Drilling Size(Mechanical) 0,15 mm
Laser drill (VIA) 0,1 mm
Buried / Blind Via  Min diam 0,2mm
Plugged holes with soldermask, copper or resin
Surface treatment HAL fara Pb, OSP, ENIG (Immersion gold), Immersion Tin, Immersion Silver
Soldermask Green, blue, red, black, white
Silkscreen black, white, yellow
Carbon deposition for the keys Yes
Peelable mask Yes
UL 94V-0 Yes
impedance control tolerance +/- 10%
Flex board Flex board with stiffener + rigid board
Special treatments Gold contacts (gold fingers-hard gold), OSP
HASL SMD 40µ to 2000µ", GND 30µ to 800µ"
ENIG Au 1µ to 5µ", Ni 80µ to 200µ"
Immersion tin 0.8µm to 1.2µm
Immersion silver 0.15µm to 0.45µm
Hard gold plating Au 1µ to 50µ", Ni 80µ to 200µ"
Peelable mask 5mil
Carbon ink 0.3mil
Half-cut/Castellated Hole Yes max 0.6 mm
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a coating that protects the copper from corrosion and reduces the chances of solder shorting between traces or unwanted electrical contact with possible loose wires. For its function of helping to prevent solder shorts, the coating is called a solder mask. Soldermask is Capability PCB Manufacturing generally green in color

Contact:
SADELEC PCB
Address:
Moldova Street no. 15,
Pașcani, Postal code 705200
 

Phone:
0722480131
0726349074
 

E-mail:
contact@sadelec-pcb.com
cad@sadelec-pcb.com