Capabilitati tehnice
| Feature | value |
| Max layer count | max 40 |
| Material | FR4, Aluminiu, CEM3, Poliamida, Rogers |
| Max. Finishing Board Size | 600 x 890 mm |
| Min. and Max. Board Thickness | min 0,2 mm; max 7 mm |
| Max. copper (inner/outer) | max 210 um |
| Min. line width | 0,12 mm |
| Min. line space | 0,12 mm |
| Min space between trace to pads, pads to pads | 0,12 mm |
| Min. Drilling Size(Mechanical) | 0,15 mm |
| Laser drill (VIA) | 0,1 mm |
| Buried / Blind Via | Min diam 0,2mm |
| Plugged holes | with soldermask, copper or resin |
| Surface treatment | HAL fara Pb, OSP, ENIG (Immersion gold), Immersion Tin, Immersion Silver |
| Soldermask | Green, blue, red, black, white |
| Silkscreen | black, white, yellow |
| Carbon deposition for the keys | Yes |
| Peelable mask | Yes |
| UL 94V-0 | Yes |
| impedance control tolerance | +/- 10% |
| Flex board | Flex board with stiffener + rigid board |
| Special treatments | Gold contacts (gold fingers-hard gold), OSP |
| HASL | SMD 40µ to 2000µ", GND 30µ to 800µ" |
| ENIG | Au 1µ to 5µ", Ni 80µ to 200µ" |
| Immersion tin | 0.8µm to 1.2µm |
| Immersion silver | 0.15µm to 0.45µm |
| Hard gold plating | Au 1µ to 50µ", Ni 80µ to 200µ" |
| Peelable mask | 5mil |
| Carbon ink | 0.3mil |
| Half-cut/Castellated Hole | Yes max 0.6 mm |
multi-layer board, an internal layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave printed circuits, transmission lines can be laid out in a planar form, such as stripline or microstrip, with dimensions carefully controlled to ensure consistent impedance. In PCB Capability Manufacturing RF and
printed circuit through its continuous improvement was one of the first aids that allowed this modernization. The smaller and smaller dimensions and the flexibility of the printed circuit board made in recent years have greatly helped fields Manufacturing PCB Capability such as medicine and aeronautics to benefit from smaller
to the pads on the other side. "SMD" components are soldered on the same side of the board. A board can use both methods for soldering components. Today PCBs Manufacturing PCB Capability with components mounted only through holes are now less common. Surface mount is used for components like transistors, diodes, IC chips, resistors
