Capabilitati tehnice
| Feature | value |
| Max layer count | max 40 |
| Material | FR4, Aluminiu, CEM3, Poliamida, Rogers |
| Max. Finishing Board Size | 600 x 890 mm |
| Min. and Max. Board Thickness | min 0,2 mm; max 7 mm |
| Max. copper (inner/outer) | max 210 um |
| Min. line width | 0,12 mm |
| Min. line space | 0,12 mm |
| Min space between trace to pads, pads to pads | 0,12 mm |
| Min. Drilling Size(Mechanical) | 0,15 mm |
| Laser drill (VIA) | 0,1 mm |
| Buried / Blind Via | Min diam 0,2mm |
| Plugged holes | with soldermask, copper or resin |
| Surface treatment | HAL fara Pb, OSP, ENIG (Immersion gold), Immersion Tin, Immersion Silver |
| Soldermask | Green, blue, red, black, white |
| Silkscreen | black, white, yellow |
| Carbon deposition for the keys | Yes |
| Peelable mask | Yes |
| UL 94V-0 | Yes |
| impedance control tolerance | +/- 10% |
| Flex board | Flex board with stiffener + rigid board |
| Special treatments | Gold contacts (gold fingers-hard gold), OSP |
| HASL | SMD 40µ to 2000µ", GND 30µ to 800µ" |
| ENIG | Au 1µ to 5µ", Ni 80µ to 200µ" |
| Immersion tin | 0.8µm to 1.2µm |
| Immersion silver | 0.15µm to 0.45µm |
| Hard gold plating | Au 1µ to 50µ", Ni 80µ to 200µ" |
| Peelable mask | 5mil |
| Carbon ink | 0.3mil |
| Half-cut/Castellated Hole | Yes max 0.6 mm |
white, although other colors are available: yellow, black, blue, red. Screen printing is used to render useful information on the PCB board that can help users during assembly. It is used to Capability Manufacturing PCB mark component values, part numbers, test points, polarity, etc. Screen printing does not influence the
it possible to measure the quality of copper tracks. The impedance is an alternating current (AC) characteristic that increases with frequency and becomes critical for printed circuits operating at frequencies above Manufacturing PCB Capability 200 or 300 Mhz. Impedance calculator software is a good starting point to determine the track width (w) and
for multilayer printed circuit boards with more than two, four and especially more than six PCB Capability Manufacturing layers of copper has been concurrent with the adoption of surface mount technology. "Through holes" components are assembled by their legs passing through the board and glued to the pads on the other side.
