Capabilitati tehnice
| Feature | value |
| Max layer count | max 40 |
| Material | FR4, Aluminiu, CEM3, Poliamida, Rogers |
| Max. Finishing Board Size | 600 x 890 mm |
| Min. and Max. Board Thickness | min 0,2 mm; max 7 mm |
| Max. copper (inner/outer) | max 210 um |
| Min. line width | 0,12 mm |
| Min. line space | 0,12 mm |
| Min space between trace to pads, pads to pads | 0,12 mm |
| Min. Drilling Size(Mechanical) | 0,15 mm |
| Laser drill (VIA) | 0,1 mm |
| Buried / Blind Via | Min diam 0,2mm |
| Plugged holes | with soldermask, copper or resin |
| Surface treatment | HAL fara Pb, OSP, ENIG (Immersion gold), Immersion Tin, Immersion Silver |
| Soldermask | Green, blue, red, black, white |
| Silkscreen | black, white, yellow |
| Carbon deposition for the keys | Yes |
| Peelable mask | Yes |
| UL 94V-0 | Yes |
| impedance control tolerance | +/- 10% |
| Flex board | Flex board with stiffener + rigid board |
| Special treatments | Gold contacts (gold fingers-hard gold), OSP |
| HASL | SMD 40µ to 2000µ", GND 30µ to 800µ" |
| ENIG | Au 1µ to 5µ", Ni 80µ to 200µ" |
| Immersion tin | 0.8µm to 1.2µm |
| Immersion silver | 0.15µm to 0.45µm |
| Hard gold plating | Au 1µ to 50µ", Ni 80µ to 200µ" |
| Peelable mask | 5mil |
| Carbon ink | 0.3mil |
| Half-cut/Castellated Hole | Yes max 0.6 mm |
and capacitance of the printed circuit board conductors become significant, usually unwanted, circuit elements; rather, they can be used as part PCB Capability Manufacturing of the circuit design, as in distributed element filters, antennas, and fuses, avoiding the need for additional separate components. High Density Interconnect (HDI) PCBs have traces and/or insulation less than 125
modernization, and the printed circuit through its continuous improvement was one of the first aids that allowed this modernization. The smaller and smaller dimensions and the flexibility of the printed circuit board made in recent years have greatly helped fields such as medicine Capability PCB Manufacturing and aeronautics to benefit
the multi-layer PCBs, the most common are the four-layer ones. The four-layer board has many more routing Capability PCB Manufacturing options in the internal layers compared to the two-layer board, and often part of the internal layers are used as a ground plane or power plane, to achieve better signal integrity, higher signaling frequencies, and better power supply
