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adjacent substrate layers. The soldering mask soldermask is made of a fluid substance like an ink and Supply components is applied in a thin layer similar to varnish on the entire surface of the printed circuit less on the soldering pads and it also has a role of antioxidation of
length, must be small enough for the current the components Supply conductor will carry. It is recommended that the power and force paths be larger than the signal paths. In a multi-layer board, an internal layer may be mostly solid copper to act as a ground plane for shielding and power
products. Currently, the production and assembly of printed circuits are automated. Electronic computer aided design software is available to do much of the layout work. Multilayer PCBs allow for much higher component density because the component paths on components Supply the inner layers would occupy the space between the
