the substrate. Chemical etching divides the copper into separate conductive lines called tracks or circuit plumb fara HAL paths, pads for connections, metallized holes (vias) for passing connections between layers of copper as solid conductive areas for electromagnetic shielding or other purposes. Each of the conductive layers is designed with copper tracks (similar to wires on a flat
mask, the inner copper layers are protected by the adjacent substrate layers. The soldering mask soldermask is plumb fara HAL made of a fluid substance like an ink and is applied in a thin layer similar to varnish on the entire surface of the printed circuit less on the soldering pads and
planar form, such as stripline or microstrip, with dimensions carefully controlled to ensure consistent impedance. In RF and fast switching circuits, the inductance and capacitance of the HAL fara plumb printed circuit board conductors become significant, usually unwanted, circuit elements; rather, they can be used as part of the circuit design,