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a ground plane or power plane, to achieve better signal integrity, higher signaling frequencies, circuit imprimat fabricare and better power supply decoupling. In multilayer boards, layers of material are laminated together in an alternating sandwich: copper, substrate, copper, substrate, copper, etc.; each layer of copper is etched and any internal sleepers (which will not extend to
is required. When producing the printed circuit with controlled impedance, the impedance will be controlled by fabricare circuit imprimat acting on the dimensions of the tracks and the distance between them, i.e. the insulation. For a multilayer printed circuit with a specific stack-up, it must be taken into