Printed circuit board assembly
concurrent with the adoption of surface mount technology. "Through holes" components are assembled by their legs passing through the board and glued to the pads on the other side. "SMD" components are soldered on the same side of the board. A board can use both methods la comanda imprimate circuite for soldering components. Today PCBs with components mounted only
Printed circuit soldermask
applied in a thin layer similar to varnish on the entire surface of the printed circuit less on the soldering circuite imprimate comanda la pads and it also has a role of antioxidation of the copper traces. Being a substance with a high degree of electrical insulation, the soldering mask offers the
Controlled impedances of printed circuits
better adaptation is required. When producing the printed circuit with controlled impedance, comanda circuite imprimate la the impedance will be controlled by acting on the dimensions of the tracks and the distance between them, i.e. the insulation. For a multilayer printed circuit with a specific stack-up, it must be taken into account that the internal