match the impedance of the upstream and downstream components. The longer the route or the higher the frequency, the better adaptation is required. When producing the printed circuit with controlled impedance, the impedance will be controlled by acting on the dimensions of the tracks and gauri cu metalizate imprimat circuit the distance between them, i.e. the insulation. For
or Polyamide for flexible circuits, and a layer of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conductive lines called tracks or gauri imprimat cu circuit metalizate circuit paths, pads for connections, metallized holes (vias) for passing connections between layers of copper as solid conductive areas for electromagnetic shielding or other purposes. Each of the
prevent solder shorts, the coating is called a solder mask. Soldermask is generally green in color but can have different colors: green, red, blue, white, black. Only the outer layers need to be covered with solder mask, the inner copper layers are protected by the adjacent substrate layers. The soldering metalizate cu gauri circuit imprimat mask soldermask is made of